The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The substrate unit includes a circuit substrate. MODULE IC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. The first region has an air cavity for generating an air impedance.
The intermediate layer includes a first region and a second region defined thereon. The intermediate layer is disposed between the upper board and the lower board. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire.
INTER-STAGE TEST STRUCTURE FOR WIRELESS COMMUNICATION APPARATUS - An inter-stage test structure for a wireless communication apparatus is provided.
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